Functional Conductive Pastes

Functional pastes are composite materials with high flowability in which functional fillers, binders, and solvents are uniformly distributed. Metallic, ceramic, or carbon materials are selected as functional fillers depending on what the paste is used for. Glass frits or polymer resins are used as binders according to the substrate type and heat treatment temperature. The workability of the paste is determined based on the applied processes, which affect its fluid properties, such as printing, dipping, and dispensing.

We are supplying Chang Sung Corporation (CSC) Firing type paste which provides optimal sintering and resistance properties in a wide temperature range and for various substrates.

  • Applications: Chip Inductors, MLCC, Silicon solar cells,
    Piezo products, LTCC, SMD Inductors.
  • Types: For Chip Components (Internal Electrode)
    For Chip Components (External Electrode)
    For Ceramics (PTC/PZT/TPC)
    For LTC /HTCC
Pastes for Internal Electrode Chip Components
Product No. Filter Firing Conditions Viscosity (Pa·s @ 10rpm) Comments
Paron-L69 Ag 850-900℃ 200-300 - Ag 82%, 88%, 90%
- Excellent line resolution
Paron-L80 Ag 850-900℃ 200-300 - Ag 78%, 82%, 85%, 88%, 90%
- High sintering density
Paron-L10 Ag 850-900℃ 200-300 - Ag 82%-88%
- Slow sintering
- Low shrinkage
Paron-L62 Ag 850-900℃ 200-300 - Ag 88%
- Fine line
Paron-L90 Ag 850-900℃ 250-350 - L90A : Fine line (30um)
- L90B : High aspect ratio (rectangular form)
Paron-L20 Ag 600-850℃ 200-300 - L20A : High shrinkage
Paron-V10 Pd 1,100-1,300℃ 50 - High reliability
Paron-V22 Ag/Pd=8/2 850-1,050℃ 35 - Electrical property control, Low cost
Paron-V23 Ag/Pd=7/3 950-1,100℃ 30 - Electrical property control
Paron-P30 Ag98/Pd2 920-940℃ 30-50 - MLPZT : Excellent sheet matching
Paron-P31 Ag 910-930℃ 30-50 - MLPZT : Excellent heat resistance